RoHS指令新豁免清单(23项)

  据了解,欧盟委员会于2003年1月27日通过的《关于在电子电气设备中使用某些有害物质的指令》(即RoHS指令)4(1)款规定:“自2006年7月1日起市场上销售的新电子电气设备不含有铅、汞、六价铬、多溴联苯和多溴联苯醚等有害物质。”今年8月18日,该委员会又通过了一项题为《为确立电子电气设备些有害物质的最大限量而修改欧盟议会和委员会2002/95/EC指令》的委员会决议(2005/618/EC),确立了电子电气设备中铅、汞、六价铬、多溴联苯和多溴联的最大允许含量,该指令的附件列出了免除该要求的产品清单。继今年1月至2月第二次征求意见以来,欧盟委员会再次对更新后的豁免清开始征求意见,本次征求意见的清单共23项,比起前次的22项有了较大变动,产畴有所加大,某些方面也更加细化。鉴于RoHS指令对我国机电产品出口的重要意义,国家质检总局特提醒相关门、出口企业、行业商协会和研究机构等相关利益方认真研究这份新的豁免清单合实际积极提出意见,争取使RoHS指令对我国电子电气设备出口欧盟的负面影响最低。

RoHS指令新豁免清单(2005-9-2)

1. Linear incandescent lamp(线型白炽灯);

2. Mercury in switches(开关中的汞);

3. Special ICs having tin-lead solder plating on leads used in professionalequipment(专业设备中所含镀有铅锡焊料的铅的特殊集成电路);

4. Specific modular units including tin-lead solder being used in special professional equipment(特殊专业设备中包含铅锡焊料的特定组合单元);

5. Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours(局部温度超过150℃且需要正常工作500小时以上的特定用途的含有铅和/或镉的焊料);

6. Lead in solder for printed circuit boards for emergency lighting products (应急照明产品中印刷电路板所用焊料中的铅);

7. Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment(表面处理用铬酸盐转化涂层中的六价铬);

8. Lead in gas sensors(烟雾探测器中的铅);

9. Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) Lamp(与用于制造背景灯的PbO(密封釉料中的铅)相关的);

10. Cadmium in opto-electronic components(光电元件中的镉);

11. Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation(依靠电子/电器元件来进行安全控制和操作的减速器和机械连接器等非消费型机械式能量传递系统);

12. Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems(加热通风和空调建筑系统、商用冷却系统和运输冷却系统中的电子和电器元件);

13. Cadmium-bearing copper alloys(含镉的铜合金);

14. Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools(含有电子/电器元件的移动和固定空气压缩机和真空系统、压缩气体污染物清除系统和气动压缩机的气体工具);

15. Electrical/electronic equipment that are: used in transport -aviation,aerospace, road, maritime, rail; installed in to the fabric of buildings ?elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications(以下电子/电气设备:航运、航天、道路、海运、铁路中使用的;建筑物构造;电梯、电动扶梯、移动走道、小型运货升降机、加热、冷却和通风系统、防火安全系统中安装的;能量产生和传输中使用的;采矿和矿石加工中使用的;非消费型机械式能量传递系统中使用的;工业作用泵和压缩机;工业制冷用的;军事设备中使用的);

16. Lead alloys as electrical/mechanical solder for transducers used in highpowered professional and commercial loudspeakers(大功率专业用和商用扩音器中的传感器中作为电气/机械焊料的铅合金);

17. Cadmium oxide(氧化镉);

18. Solder tin of the thermo fuse with a defined low melting point(有固定低熔点的温度保险丝中的锡焊料);

19. Lead in lead oxide glass used in plasma display panel (PDP)(氧化铅玻璃等离子显示器面板中使用的铅);

20. Lead in solder on small PCB and tinned legs of primary components(小型印刷电路板和初级元件的镀锡引线所用焊料中的铅);

21. Use of the not lead free component NEC V25 in the Memor 2000(2000年备忘录中非无铅元件NEC V25的使用);

22. Lead used in shielding of radiation for Non Medical X-ray equipment(非医用X光机的射线防护屏中使用的铅);

23. Lead based solders sealed or captured within heat-shrinkable components and devices(热收缩性元件和设备中密封或俘获的铅基焊料)